According to drawing
Polyimide is a non-melting high-temperature polymer. Strength, dimensional stability, and creep resistance remain high even at temperatures above 260°C. Low wear rates combined with the ability to work under unlubricated conditions and high PV rates make it the ideal material for challenging friction and wear applications, extending its lifetime and reducing maintenance costs. Its high purity and low outgassing are needed for applications in the vacuum, space, and semiconductor industry.
JHPI-10 is equivalent to Vespel SP-1.
JHPI-10 is the unfilled standard type of thermosetting polyimide polymer with maximum strength and elongation and the lowest young's modulus. This material also has low thermal conductivity and optimal electrical properties. The highest-temperature resistance grade, long-termed use temperature is up to 350°C- 380°C.
High strength, modulus, and stiffness also at high temperatures over 260 °C
Excellent dimensional stability to 350°C continuous use. (short-term up to 400°C)
Superior wear and creep resistance
Exceptional performance under load and at high temperatures
Low thermal and electrical conductivity
Low coefficient of friction
Food processing, packaging equipment running at a faster rate, improve reliability, and because of food processing and packaging process of cleaning, milling, sterilization, oil-free, aseptic packaging process complexity, so the packaging equipment reliability and life of critical components proposed new stringent requirements previously used traditional materials such as Nylon, ultra-high molecular weight polyethylene, Teflon, graphite and other materials have been unable to meet the increasingly high-speed packaging equipment, wear, corrosion-resistant, non-toxic requests. And because plastic polyimide most excellent high temperature, wear resistance, corrosion resistance, overall performance, high strength, and the most successful application to solve the food processing and packaging machinery and equipment, key parts of the design, manufacture, and use of technical problems.
Technical Data Sheet-- PI
(Unfilled base resin)
(Containing 15% of graphite)
(Containing 40% of graphite)
(Unfilled base resin)
(Semi-transparent moulded )
(Extrusion thermoplastic PI)
(Molded thermoplastic PI)
|Tensile strength||ISO 527||MPa||96||90||60||92||121||90||97|
|Ultimate Elongation||ISO 527||%||10||5||2.5||8||13||8||8|
|Bending strength||ISO 178||MPa||148||126||90||140||171||130||138|
|Compression strength||ISO 604||MPa||152||135||95||150||175||140||148|
|Impact strength||ISO 180/U||KJ/m2||90||55||13||88||145（No break)||100||130（No break)|
|Distortion temperature||ISO 75-f||℃||＞300||＞300||＞300||＞320||255||230||250|
|Heat deflection temperature||——||℃||350||350||350||380||250||250||250|
|▶ This table is a valuable help in the choice of a material. The data listed here fall with in the normal range of product properties of dry material.|
However, they are not guaranteed and they should not be used to establish material specification limits nor used alone as the basis of design