PEEK Semiconductor Wafer Handling

Vacuum Pickup Introduction

一、Classification

1. Moulding type 

3 materials, Unfilled PEEK, Carbon reinforced PEEK, ESD PEEK, using temperature to reach 160%. So far, there are 6 inches , 8 inches and 12 inches sizes for customer selection.

2. Machining type

Compared with moulding type, machining with wide variety, high processing accuracy, more diverse materials. Common specifications are 2 inches, 4 inches; Common materials include PEEK5600G, PEEK5600ESD, JHPI-10 and so on。

二、Bending customization 

In order to better meet the requirements of customer customization, the company provides suction tip bending service. Generally, there are four bending directions for the bent tip. To facilitate identification and prevent confusion, the coding requirements are as follows (illustrated by examples) :

JHXT-120301U30 means: a pen tip made by bending the 12" pen tip No. JHXT-120301 upward by 30° with the working side down.

JHXT-120301D30 indicates: a pen tip made by bending a 12" pen tip numbered JHXT-120301 downward at 30° with the working side down.

JHXT-120301R20: a pen tip made by bending the 12" pen tip No. JHXT-120301 to the right with the working side down by 20°.

JHXT-120301L20 means: a pen tip made by bending the 12" pen tip No. JHXT-120301 to the left with the working side down by 20°.

In order to ensure that the bending does not affect the performance of the product, the maximum angle of upward and downward bending is 30°, and the maximum angle of leftward and rightward bending is 20°.

三、Assembly method

There are currently two types of pen tip assembly, inline and threaded.

四、Product Case