High-Thermal-Conductivity PEEK: Making High-Performance Thermal Management Within Reach

Jiangsu Junhua HPP Co., Ltd. (hereinafter “Junhua”) has officially released a series of high-thermal-conductivity modified PEEK compounds and matching extruded stock shapes.

The new products cover injection-molding-grade compounds and high-thermal-conductivity PEEK sheet. They combine high thermal conductivity with good processability, and are available in either highly insulating or highly conductive grades. They are suited to thermal management applications in semiconductor optoelectronics, new-energy power devices, and high-end industrial equipment. The launch further reduces dependence on imported high-end thermally conductive specialty engineering plastics and provides a domestically sourced material solution for high-end manufacturing in China.

As new-energy power devices and semiconductor optical module equipment move toward smaller size, higher power, and higher integration, heat flux density inside these devices keeps rising. Heat dissipation now directly affects system stability and service life.

Neat PEEK 5600G resin has a thermal conductivity of about 0.25 W/m·K, which limits heat transfer. Some thermally conductive PEEK compounds on the market also suffer from uneven filler dispersion, poor melt flow, difficult injection mold filling, dust generation during machining, high-temperature outgassing contamination, and poor dimensional stability. As a result, they struggle to meet thermal efficiency, precision molding, and clean-room requirements at the same time.

An integrated value chain behind the material

Drawing on an integrated value chain that spans in-house PEEK resin polymerization, compounding and pelletizing, and profile extrusion, Junhua uses functionalized thermally conductive filler combinations and an optimized filler–matrix interface to build a continuous heat-conduction network within the material. The compounding and extrusion annealing processes were also specifically tuned. Together these raise thermal conductivity while preserving as far as possible the core PEEK properties: high-temperature resistance, high strength, chemical resistance, and dimensional stability.

Two product forms: compound and extruded sheet

The launch covers two product forms: injection-molding-grade high-thermal-conductivity PEEK compound and extruded sheet. The pellets are uniform and highly consistent from batch to batch, and can be used directly in injection molding for heat-dissipating parts other than thin-wall components. The matching PEEK sheet is intended for CNC machining of heat-sink fixtures, bases, and load-bearing parts. It resists dust and chip shedding during machining and releases little metal ion contamination, meeting the requirements of high-cleanliness environments such as semiconductor production.

Insulating and conductive grades

The series is available in electrically insulating and electrically conductive grades. The insulating grades conduct heat without conducting electricity, removing the short-circuit risk associated with metal heat sinks. Continuous service temperature reaches 250–260 °C, and dimensional change under thermal cycling is low. The materials also retain PEEK’s inherent wear resistance and self-lubrication, chemical resistance, and light weight. They can replace some metal heat-dissipation components, reducing equipment weight while improving electrical safety.

Performance data: PEEK5600HTC compounds

Notes. 1. Values are injection-molded properties. For more detailed technical data, please contact our technical department. 2. These performance figures are not to be used as material acceptance criteria.

Main application areas

• New energy: insulating heat-sink bases for IGBT power modules, motor heat-dissipation structural parts, and electronic control heat-dissipation components.
• Semiconductors and optical communications: heat-sink bases for optical modules, high-temperature wafer test carriers, and thermal management fixtures for RF modules.
• High-end industrial equipment: high-speed heat-dissipation bearings, bushings, sliding-friction heat-dissipation parts, and positioning and heat-dissipation parts for high-temperature instruments.
• Other: analytical and testing instruments, and airborne insulating heat-dissipation components for aviation.

Performance data: PEEK5600HTC S01 extruded sheet

Values for the extruded sheet differ by direction of measurement. Longitudinal values run along the extrusion direction; transverse values run perpendicular to it.

Notes. 1. Values are extruded properties. For more detailed technical data, please contact our technical department. 2. These performance figures are not to be used as material acceptance criteria.

Validation, documentation, and supply

Junhua’s high-thermal-conductivity PEEK compounds and stock shapes have completed full internal performance validation. Custom development is available across thermal conductivity levels, electrical properties, and mechanical targets, with small-batch samples and volume supply.

Junhua also provides injection molding process references and machining guidance to shorten customer qualification cycles. Every shipment includes a batch performance test report covering key data such as thermal conductivity and tensile and flexural properties, so material performance is traceable and meets customer requirements for R&D, supplier audits, and production quality control.

Looking ahead, Junhua will continue to invest in PEEK specialty polymer innovation, developing new products around thermal management, antistatic, and reinforcement functions, and supporting independent, self-controlled material supply and high-quality development for China’s new-energy, semiconductor, and high-end equipment industries.